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THERMOSINK 35-3

Resin Designs

$800.00
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SKU:
73021
spec_Color:
Part A: Grey | B: White
spec_Set_Time:
30 to 60 minutes
spec_Standard_Operating_Temperature_Range:
minus 76° F to 365° F | (-60° C to 185° C)
spec_Cure_Time:
15 min @ 125°C or 4 hrs RT
Color:
Part A: Grey | B: White
MBU:
ABC
MBU_Description:
ADHESIVES BONDING AND COATINGS
On_Web_(Y/N):
Yes
Set_Time:
30 to 60 minutes
Short_Description:
A two-component, low viscosity, thermally conductive silicone elastomer that cures rapidly at room temperature.
Standard_Operating_Temperature_Range:
minus 76° F to 365° F | (-60° C to 185° C)
TDS_Description:
THERMOSINK 35-3 Technical Data Sheet
TDS_Link:
https://cdnresources.chasecorp.com/7RYJKHTS/at/4cbvshm39h7sjx5jtw6kg56/ThermoSink_35-3.pdf
Cure_Time:
15 min @ 125°C or 4 hrs RT
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A two-component, low viscosity, thermally conductive silicone elastomer that cures rapidly at room temperature. It is designed for electrical potting and thermal interface applications where high-performance heat transfer and thermal management is required.

Overview

A two-component, low viscosity, thermally conductive silicone elastomer that cures rapidly at room temperature. This product is specifically engineered for electrical potting and thermal interface applications, requiring high-performance heat transfer and effective thermal management solutions.

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THERMOSINK 35-3 has been formulated to meet the demands of various industries, particularly in environments where efficient thermal conductivity is vital. The rapid curing at room temperature ensures minimal production downtime, making it an ideal choice for manufacturers looking to enhance their operational efficiency.

 

Key Features

  • Two-component system: Simple mixing process enhances user convenience.
  • Low viscosity: Facilitates easy application and ensures uniform coverage.
  • Rapid room temperature cure: Reduces lead times in manufacturing processes.
  • High thermal conductivity: Ensures efficient heat transfer for optimal device performance.
  • Versatile applications: Suitable for various electrical and thermal interface needs.

 

Applications

  • Electrical potting for circuit protection.
  • Thermal interface for heat sinks and electronic components.
  • Sealing and bonding in medical devices.
  • Connector sealing to guard against environmental factors.
  • EMI shielding for sensitive electronic systems.

 

Benefits

  • Enhances product reliability by improving heat dissipation.
  • Increases the lifespan of electronic devices through effective thermal management.
  • Provides excellent adhesion to multiple substrates, including metal, glass, and plastic.
  • Compliant with RoHS and REACH regulations, ensuring safety in applications.
  • Fully ISO-9001 certified manufacturing processes ensure consistent quality.

 

Flexible and robust, THERMOSINK 35-3 is a strategic choice for industries such as electronics, aerospace, and military. Its advanced formulation, combined with compliance to industry standards, guarantees superior performance and quality, making it a trusted solution for thermal and electrical applications.

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