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TP-2101 Gap Filler Thermal Pad

Resin Designs

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SKU:
TP-2101 Gap Filler Thermal Pad
spec_Specific_Gravity:
1.9
On_Web_(Y/N):
Yes
Short_Description:
A highly compressible, silicone gap filler with moderate bulk conductivity and low surface tack on both sides of the pad. This filler uses foam reinforcement to maintain compressibility.
Specific_Gravity:
1.9
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A highly compressible, silicone gap filler with moderate bulk conductivity and low surface tack on both sides of the pad. This filler uses foam reinforcement to maintain compressibility. It is ideal for use in low-power applications requiring heat transfer across any large airgap.

Overview

A highly compressible, silicone gap filler with moderate bulk conductivity and low surface tack on both sides of the pad. This filler uses foam reinforcement to maintain compressibility. It is ideal for use in low-power applications requiring heat transfer across any large airgap.

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